NCP5201

http://onsemi.com

4

RL1 = 100 k

W, R7 = 1.0 kW, R10 = 1.0 k, R12 = 20 kW, R6 = 16 W, C12 = 3.0 nF, C11 = 6.0 nF, C10 = 80 nF, for min/max values unless

otherwise noted)

Characteristic

Unit

Max

Typ

Min

Test Conditions

Symbol

CONTROL SECTION

S3_EN Pin Threshold HIGH

−

S3_EN_H

1.4

−

−

V

S3_EN Pin Threshold LOW

−

S3_EN_L

−

−

0.5

V

S3_EN Pin Input Current

−

IIN_EN

−

−

0.5

mA

PWRGD Pin ON Resistance

−

PWRGD_R

−

−

80

W

PWRGD Pin OFF Current

−

PWRGD_

LEAK

−

−

1.0

mA

PWRGD LOW−to−HIGH Hold Time,

For S3 to S0 or S5 to S0

−

thold

−

−

200

ms

GATE DRIVERS

TGDDQ Gate Pull−HIGH Resistance

VCC = 12 V,

V(TGDDQ) = 11

V

RH_TG

−

3.0

−

W

TGDDQ Gate Pull−LOW Resistance

VCC = 12 V,

V(TGDDQ) = 1.0

V

RL_TG

−

2.5

−

W

BGDDQ Gate Pull−HIGH Resistance

VCC = 12 V,

V(BGDDQ) = 11

V

RH_BG

−

3.0

−

W

BGDDQ Gate Pull−LOW Resistance

VCC = 12 V,

V(BGDDQ) = 1.0

V

RL_BG

−

1.3

−

W

PIN DESCRIPTION

Pin No.

Symbol

Description

1

FBDDQ

VDDQ feedback pin for closed loop regulation.

2

FBVTT

VTT regulator sense voltage.

3

PGND

Power ground.

4

VSTBY

5 V Standby input voltage.

5, 6

VTT

VTT regulator output.

7

OCDDQ

Overcurrent sense and program input for the VDDQ high−side FET.

8

VDDQ

Reference input and power stage input for VTT regulator.

9

NC

Not connected.

10

PWRGD

Open drain status output. High impedance when the product is operating in S0 state and both

DDQ and VTT regulators are in compliance.

11

S3_EN

S3 mode enable input. High to enable.

12

AGND

Analog ground connection and remote ground sense.

13

SDDQ

Inductor driven node and current limit sense input.

14

BGDDQ

Gate driver output, VDDQ Low−Side N−Channel Power FET. Active during S0 mode.

15

TGDDQ

Gate driver output, VDDQ High−Side N−Channel Power FET. Active during S0 mode.

16

VCC

12 Volt input supply. This voltage is monitored by power good circuitry for mode selection.

17

COMP

VDDQ error amplifier compensation node.

18

SS

Soft−start capacitor connection to ground.

19

TH_PAD

Copper pad on bottom of IC used for heatsinking. This pin should be connected to the ground

plane under the IC.