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HSDL-3000007 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HSDL-3000007 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
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8 / 16 page  8 Moisture Proof Packaging The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature 10 °C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recom- mended storage conditions. Baking If the parts are not stored in a dry environment, they must be baked before reflow process to prevent damage to parts. Baking should be done only once. Packaging Baking Temperature Baking Time In Reel 60 °C ≥ 48 hours In Bulk 100 °C ≥ 4 hours 125 °C ≥ 2 hours 150 °C ≥ 1 hour |
Similar Part No. - HSDL-3000007 |
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Similar Description - HSDL-3000007 |
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