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HSDL-3000007 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HSDL-3000007 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
11 / 16 page 11 1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. mm Inches h min. 0.40 min. 0.016 j 10.1 0.40 k 3.85 0.15 l 3.2 0.126 Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask. • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. • “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. • It is recommended that 2 fiducial cross be placed at mid- length of the pads for unit alignment. Note: Wet/Liquid Photo- Imageable solder resist/mask is recommended. h l Tx LENS Rx LENS j SOLDER MASK LAND k Y X 2.0 Recommended Solder Paste/ Cream Volume for Castellation Joints The recommended printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). |
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