3

SY89223L

Micrel, Inc.

M9999-051805

hbwhelp@micrel.com or (408) 955-1690

Power Supply Voltage (V

PECL Input Voltage (V

Voltage Applied to Output at HIGH State

(V

Current Applied to Output at LOW State

(I

Lead Temperature (soldering, 20 sec.) ..................... 260

°C

Storage Temperature (T

Power Supply Voltage (V

Ambient Temperature (T

Package Thermal Resistance,(Note 3)

MLF™

(θ

Still-Air ............................................................. 93

°C/W

500lfpm ............................................................ 87

°C/W

MLF™

(ψ

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

OH

Output HIGH Voltage

I

2.0

V

V

OL

Output LOW Voltage

I

0.5

V

I

CC

Power Supply Current

30

mA

I

OS

Output Short Circuit Current

V

–80

–240

mA

LVTTL DC ELECTRICAL CHARACTERISTICS

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

IH

Input HIGH Voltage

V

—

V

V

V

IL

Input LOW Voltage

V

—

V

V

V

IHCMR

Input HIGH Common Mode Range

Note 4

1.2

—

V

CC

V

V

PP

Minimum Input Swing

200

—

—

mV

I

IH

Input HIGH Current

—

—

150

µA

I

IL

Input LOW Current

0.5

—

—

µA

Note 1.

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG

conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.

Note 4.

V

LVPECL DC ELECTRICAL CHARACTERISTICS