© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSQ211 Rev. 1.0.0

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

Symbol

Parameter

Value

Unit

Drain Pin Voltage

650

V

Vstr Pin Voltage

650

V

Drain-Gate Voltage

650

V

Gate-Source Voltage

±

20

V

Supply Voltage

20

V

Feedback Voltage Range

V

Total Power Dissipation

1.40

W

Operating Junction Temperature

Internally limited

°C

Operating Ambient Temperature

-25 to +85

°C

Storage Temperature

-55 to +150

°C

Notes:

1.

Repetitive rating: Pulse width is limited by maximum junction temperature.

2.

Thermal Impedance

Symbol

Parameter

Value

Unit

8DIP

Junction-to-Ambient Thermal Impedance

(3)

89

°C/W

Junction-to-Case Thermal Impedance

(4)

14

°C/W

Notes:

3.

Free standing with no heatsink; without copper clad. Measurement condition – Just before junction temperature

4.

Measured on the DRAIN pin close to plastic interface.

5.

All items are tested with the JEDEC standards: JESD 51-2 and 51-10 (DIP).