PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

MAX3222ECDB

ACTIVE

SSOP

DB

20

70

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECDBR

ACTIVE

SSOP

DB

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECDW

ACTIVE

SOIC

DW

20

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECDWR

ACTIVE

SOIC

DW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECPW

ACTIVE

TSSOP

PW

20

70

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECPWR

ACTIVE

TSSOP

PW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222ECRHLR

PREVIEW

QFN

RHL

24

1000

TBD

Call TI

Call TI

MAX3222EIDB

ACTIVE

SSOP

DB

20

70

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIDBR

ACTIVE

SSOP

DB

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIDW

ACTIVE

SOIC

DW

20

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIDWR

ACTIVE

SOIC

DW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIPW

ACTIVE

TSSOP

PW

20

70

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIPWR

ACTIVE

TSSOP

PW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX3222EIRHLR

PREVIEW

QFN

RHL

24

1000

TBD

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2006

Addendum-Page 1