SGA-8343Z datasheet(4/4 Pages) SIRENZA

Part #	SGA-8343Z

Description	Low Noise, High Gain SiGe HBT

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Manufacturer	SIRENZA [SIRENZA MICRODEVICES]

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SGA-8343 Low Noise SiGe HBT

4

EDS-101845 Rev F

303 Technology Court, Broomfield, CO 80021

Phone: (800) SMI-MMIC

http://www.sirenza.com

#

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Pin Description

Caution: ESD sensitive

Appropriate precautions in handling, packaging and

testing devices must be observed.

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S"

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Part Number Ordering Information

The part will be symbolized with the “A83” or

“A83Z” designator and a dot signifying pin 1 on

the top surface of the package.

Part Symbolization

Use multiple plated-through vias holes located

close to the package pins to ensure a good RF

ground connection to a continuous groundplane

on the backside of the board.

Recommended PCB Layout

SOT-343

Package

Plated Thru

Holes

(0.020" DIA)

Ground

Plane

L

C

5. DIE IS FACING UP FOR MOLD AND FACING DOWN

2.25

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C

6. PACKAGE SURFACE TO BE MIRROR FINISH.

FOR TRIM/FORM. ie :REVERSE TRIM/FORM.

SYMBOL

4. ALL SPECIFICATIONS COMPLY TO EIAJ SC70.

2. DIMENSIONS ARE INCLUSIVE OF PLATING.

3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH

1. ALL DIMENSIONS ARE IN MILLIMETERS.

& METAL BURR.

NOTE:

0.25

0.10

0.00

0.80

1.80

0.80

1.85

1.15

MIN

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Q1

A2

A1

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A

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E

0.65 BSC

0.40

0.18

0.40

0.10

1.00

2.40

1.10

1.35

MAX

L

0.10

0.30

b1

0.55

0.70

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Q1

A

A1

Package Dimensions

A83

1

4

2

3

1

4

2

3

A83

A83Z

MARKING

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