PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN65C3221DB

ACTIVE

SSOP

DB

16

80

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221DBE4

ACTIVE

SSOP

DB

16

80

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221DBR

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221DBRE4

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221DW

PREVIEW

SOIC

DW

16

40

TBD

Call TI

Call TI

SN65C3221DWR

PREVIEW

SOIC

DW

16

2000

TBD

Call TI

Call TI

SN65C3221PW

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221PWE4

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221PWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN65C3221PWRE4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221DB

PREVIEW

SSOP

DB

16

80

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221DBR

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221DBRE4

ACTIVE

SSOP

DB

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221DW

PREVIEW

SOIC

DW

16

40

TBD

Call TI

Call TI

SN75C3221DWR

PREVIEW

SOIC

DW

16

2000

TBD

Call TI

Call TI

SN75C3221PW

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221PWE4

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221PWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN75C3221PWRE4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

PACKAGE OPTION ADDENDUM

www.ti.com

18-Jul-2006

Addendum-Page 1