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FMA3008 Datasheet(PDF) 4 Page - Filtronic Compound Semiconductors |
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FMA3008 Datasheet(HTML) 4 Page - Filtronic Compound Semiconductors |
4 / 5 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com FMA3008 Preliminary Datasheet v2.1 BIASING CIRCUIT SCHEMATIC: Website: www.filtronic.com 4 ASSEMBLY DIAGRAM: It is recommended that the RF connections be made using two bond wires 25µm in diameter and a maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for bond wire length, with the addition of a microstrip transformer, shown in the diagram below. Substrate: Alumina Thickness: 635µm Dimensions in mm Transformer Impedance 36 Ω Electrical Length 21º at 10GHz BILL OF MATERIALS: COMPONENT All RF tracks should be 50 Ω characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100pF, 0402 Optional Circuit for external cascade Gate Control RF Output 100pF VDD VG1 100pF nF 100nF RF Input VG2 100nF 100pF 100 To Evaluation Board via an 0402 Surface Mounted capacitor 0.61 0.61 100pF Chip Capacitor 100pF Chip Capacitors 0.65 1.1 1.1 0.65 To Evaluation Board via an 0402 Surface Mounted capacitor |
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Similar Description - FMA3008 |
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