B560C-13-F datasheet(1/3 Pages) DIODES

Part #	B560C-13-F

Description	5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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Manufacturer	DIODES [Diodes Incorporated]

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DS13012 Rev. 8 - 2

1 of 3

B520C-B560C

www.diodes.com

ã Diodes Incorporated

Characteristic

Symbol

B520C

B530C

B540C

B550C

B560C

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR

20

30

40

50

60

V

RMS Reverse Voltage

VR(RMS)

14

21

28

35

42

V

Average Rectified Output Current

@ TT = 90°C

IO

5.0

A

Non-Repetitive Peak Forward Surge Current, 8.3 ms single

half-sine-wave Superimposed on Rated Load

IFSM

175

A

Forward Voltage

@ IF = 5.0A DC

VFM

0.55

0.70

V

Peak Reverse Current

@ TA = 25°C

at Rated DC Blocking Voltage

@ TA = 100°C

IRM

0.5

20

mA

Typical Total Capacitance (Note 2)

CT

300

pF

Thermal Resistance, Junction to Terminal

RqJT

10

°C/W

Thermal Resistance, Junction to Ambient (Note 1)

RqJA

50

°C/W

Operating Temperature Range

Tj

-55 to +125

°C

Storage Temperature Range

TSTG

-55 to +150

°C

B520C - B560C

5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Features

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified

·

Guard Ring Die Construction for Transient Protection

·

Ideally Suited for Automatic Assembly

·

Low Power Loss, High Efficiency

·

Surge Overload Rating to 175A Peak

·

For Use in Low Voltage, High Frequency Inverters, Free

Wheeling, and Polarity Protection Application

·

Lead Free Finish/RoHS Compliant (Note 3)

Mechanical Data

·

Case: SMC

·

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

·

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Lead Free Plating (Matte Tin Finish).

Solderable per MIL-STD-202, Method 208

·

Polarity: Cathode Band or Cathode Notch

·

Marking Information: See Page 3

·

Ordering Information: See Page 3

·

Weight: 0.21 grams (approximate)

SMC

Dim

Min

Max

A

5.59

6.22

B

6.60

7.11

C

2.75

3.18

D

0.15

0.31

E

7.75

8.13

G

0.10

0.20

H

0.76

1.52

J

2.00

2.62

All Dimensions in mm

A

B

C

D

G

H

E

J

Notes:

1. Thermal Resistance: Junction to ambient, unit mounted on PC board with 8.0 mm2 (0.033 mm thick) copper pads as heat sink.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.

3. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.

SPICE MODELS: B520C B530C B540C B550C B560C

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