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FN3279.4

March 10, 2005

Die Characteristics

DIE DIMENSIONS:

180 mils x 197 mils x 21

±1 mils

INTERFACE MATERIALS:

Glassivation:

Thickness: 8k

Top Metallization:

Metal 1 - Type: Moly/TiW

Thickness: 5.8k

Metal 2- Type: Al/Si/Cu

Thickness: 10k

Backside Finish:

Silicon

ASSEMBLY RELATED INFORMATION:

Substrate Potential (Powered Up):

ADDITIONAL INFORMATION:

Worst Case Current Density:

Metal 1 - Designs using the Intersil AVLSI-1RA process

take advantage of the superior current carrying

capabilities of Moly.TiW. The current density limit

Process:

AVLSI1RA

Metallization Mask Layout

HS-9008RH

HS-9008RH