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AM29LV017D-90FC Datasheet(PDF) 9 Page - Advanced Micro Devices |
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AM29LV017D-90FC Datasheet(HTML) 9 Page - Advanced Micro Devices |
9 / 48 page Am29LV017D 11 Special Handling Instructions for FBGA Packages Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. PIN CONFIGURATION A0–A20=21 addresses DQ0–DQ7=8 data inputs/outputs CE# = Chip enable OE# = Output enable WE# = Write enable RESET#=Hardware reset pin, active low RY/BY#=Ready/Busy output VCC = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VSS = Device ground NC = Pin not connected internally LOGIC SYMBOL 21 8 DQ0–DQ7 A0–A20 CE# OE# WE# RESET# RY/BY# |
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