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AM29LV640DU120RPCI Datasheet(PDF) 5 Page - Advanced Micro Devices |
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AM29LV640DU120RPCI Datasheet(HTML) 5 Page - Advanced Micro Devices |
5 / 57 page January 22, 2007 22366C6 Am29LV640D/Am29LV641D 3 D A TA SH EE T TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Handling Instructions for FBGA/fBGA Packages ......... 7 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations .....................................................10 VersatileIO ™ (V IO) Control ..................................................... 10 Requirements for Reading Array Data ................................... 10 Writing Commands/Command Sequences ............................ 11 Accelerated Program Operation ......................................................11 Autoselect Functions .......................................................................11 Standby Mode ........................................................................ 11 Automatic Sleep Mode ........................................................... 11 RESET#: Hardware Reset Pin ............................................... 11 Output Disable Mode .............................................................. 12 Table 2. Sector Address Table ........................................................12 Autoselect Mode ..................................................................... 16 Table 3. Autoselect Codes, (High Voltage Method) .......................16 Sector Group Protection and Unprotection ............................. 17 Table 4. Sector Group Protection/Unprotection Address Table .....17 Write Protect (WP#) ................................................................ 18 Temporary Sector Group Unprotect ....................................... 18 Figure 1. Temporary Sector Group Unprotect Operation................ 18 Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19 SecSi (Secured Silicon) Sector Flash Memory Region .......... 20 Table 5. SecSi Sector Contents ......................................................20 Hardware Data Protection ...................................................... 20 Low VCC Write Inhibit .....................................................................20 Write Pulse “Glitch” Protection ........................................................21 Logical Inhibit ..................................................................................21 Power-Up Write Inhibit ....................................................................21 Common Flash Memory Interface (CFI) . . . . . . . 21 Table 6. CFI Query Identification String .......................................... 21 System Interface String................................................................... 22 Table 8. Device Geometry Definition .............................................. 22 Table 9. Primary Vendor-Specific Extended Query ........................ 23 Command Definitions . . . . . . . . . . . . . . . . . . . . . 23 Reading Array Data ................................................................ 23 Reset Command ..................................................................... 24 Autoselect Command Sequence ............................................ 24 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24 Word Program Command Sequence ..................................... 24 Unlock Bypass Command Sequence ..............................................25 Figure 3. Program Operation .......................................................... 25 Chip Erase Command Sequence ........................................... 25 Sector Erase Command Sequence ........................................ 26 Erase Suspend/Erase Resume Commands ........................... 26 Figure 4. Erase Operation............................................................... 27 Command Definitions ............................................................. 28 Command Definitions...................................................................... 28 Write Operation Status . . . . . . . . . . . . . . . . . . . . . 29 DQ7: Data# Polling ................................................................. 29 Figure 5. Data# Polling Algorithm ................................................... 29 RY/BY#: Ready/Busy# ............................................................ 30 DQ6: Toggle Bit I .................................................................... 30 Figure 6. Toggle Bit Algorithm........................................................ 30 DQ2: Toggle Bit II ................................................................... 31 Reading Toggle Bits DQ6/DQ2 ............................................... 31 DQ5: Exceeded Timing Limits ................................................ 31 DQ3: Sector Erase Timer ....................................................... 31 Table 11. Write Operation Status ................................................... 32 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33 Figure 7. Maximum Negative Overshoot Waveform ..................... 33 Figure 8. Maximum Positive Overshoot Waveform....................... 33 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 9. I CC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ........................................... 35 Figure 10. Typical I CC1 vs. Frequency ............................................ 35 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 11. Test Setup.................................................................... 36 Table 12. Test Specifications ......................................................... 36 Key to Switching Waveforms. . . . . . . . . . . . . . . . 36 Figure 12. Input Waveforms and Measurement Levels...................................................................... 36 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 Read-Only Operations ........................................................... 37 Figure 13. Read Operation Timings ............................................... 37 Hardware Reset (RESET#) .................................................... 38 Figure 14. Reset Timings ............................................................... 38 Erase and Program Operations .............................................. 39 Figure 15. Program Operation Timings.......................................... 40 Figure 16. Accelerated Program Timing Diagram.......................... 40 Figure 17. Chip/Sector Erase Operation Timings .......................... 41 Figure 18. Data# Polling Timings (During Embedded Algorithms)...................................................... 42 Figure 19. Toggle Bit Timings (During Embedded Algorithms)...................................................... 43 Figure 20. DQ2 vs. DQ6................................................................. 43 Temporary Sector Unprotect .................................................. 44 Figure 21. Temporary Sector Group Unprotect Timing Diagram ... 44 Figure 22. Sector Group Protect and Unprotect Timing Diagram .. 45 Alternate CE# Controlled Erase and Program Operations ..... 46 Figure 23. Alternate CE# Controlled Write (Erase/Program) Operation Timings .............................................. 47 Erase And Programming Performance . . . . . . . 48 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 48 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49 SSO056—56-Pin Shrink Small Outline Package (SSOP) ...... 49 FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 12 x 11 mm package ................................................. 50 LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm package ................................................. 51 TS 048—48-Pin Standard TSOP ............................................ 52 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53 |
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