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AM29LV200BT-70DPC Datasheet(PDF) 9 Page - Advanced Micro Devices |
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AM29LV200BT-70DPC Datasheet(HTML) 9 Page - Advanced Micro Devices |
9 / 11 page November 18, 2003 Am29LV200B Known Good Die 9 SU PP L E ME NT PHYSICAL SPECIFICATIONS Active Die dimensions . x = 3462.6 µm; y = 3277.8 µm . . . . . . . . . . . . . . . . . . . x = 136.3 mils; y = 129.0 mils Scribe width . . . . . . . . . . . . x = 87.4 µm; y = 232.2 µm . . . . . . . . . . . . . . . . . . . . . x = 3.44 mils; y = 9.03 mils Step dimensions . . . . . . . . x = 3.56 mm; y = 3.51 mm . . . . . . . . . . . . . . . . . x = 139.76 mils; y = 138.19 mils Die Thickness. . . . . . . . . . . . .500 µm = 483 +/–51 µm . . . . . . . . . . . . . . . . . . . . . . . 280 µm = 280 +/–15 µm Bond Pad Size . . . . . . . . . . . . . . 115.9 µm x 115.9 µm . . . . . . . . . . . . . . . . . . . . . . . . . . 4.69 mils x 4.69 mils Minimum pad pitch . . . . . . . . . . . . . . . . . . . . 137.8 µm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.43 mils Pad Area Free of Passivation . . . . . . . . . . 13.99 mils 2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu . . . . . . . . . . . . . . . . . . . . Minimum thickness: 10500 Å Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded with Back-grind type finish (optional) Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride . . . . . . . . . . . . . . . . . . . . Minimum thickness: 14700 Å Ink dot height . . . . . . . . . . . . . . . . . . . . . .0.8 mils max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20.3 µm max Ink dot diameter . . . . . . . . . . . . . . . . . . . . .15 mils min . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 µm min DC OPERATING CONDITIONS VCC (Supply Voltage) . . . . . . . . . . . . . . 2.7 V to 3.6 V Operating Temperature Industrial . . . . . . . . . . . . . . . . . . .–40 °C to +85°C Commercial . . . . . . . . . . . . . . . . . . .0 °C to +70°C Extended . . . . . . . . . . . . . . . . . .–55 °C to +125°C MANUFACTURING INFORMATION Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Test . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia Manufacturing ID (Top Boot) . . . . . . . . . . . . . 98488AK (Bottom Boot) . . . . . . . . . . . . . . . . . . . . . . .98488ABK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250 °C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30 °C in a nitrogen- purged cabinet or vacuum-sealed bag. Observe all |
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