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74F1071MTC Datasheet(PDF) 1 Page - Fairchild Semiconductor

Part # 74F1071MTC
Description  18-Bit Undershoot/Overshoot Clamp and ESD Protection Device
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

74F1071MTC Datasheet(HTML) 1 Page - Fairchild Semiconductor

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© 2005 Fairchild Semiconductor Corporation
DS011685
www.fairchildsemi.com
October 1994
Revised March 2005
74F1071
18-Bit Undershoot/Overshoot Clamp
and ESD Protection Device
General Description
The 74F1071 is an 18-bit undershoot/overshoot clamp
which is designed to limit bus voltages and also to protect
more sensitive devices from electrical overstress due to
electrostatic discharge (ESD). The inputs of the device
aggressively clamp voltage excursions nominally at 0.5V
below and 7V above ground.
Features
s 18-bit array structure in 20-pin package
s FAST
£ Bipolar voltage clamping action
s Dual center pin grounds for min inductance
s Robust design for ESD protection
s Low input capacitance
s Optimum voltage clamping for 5V CMOS/TTL
applications
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Connection Diagram
Note: Simplified Component Representation
FAST
£ is a registered trademark of Fairchild Semiconductor Corporation.
Order Number
Package
Package Description
Number
74F1071SC
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74F1071SCX_NL
(Note 1)
M20B
Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74F1071MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74F1071MSAX_NL
(Note 1)
MSA20
Pb-Free 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74F1071MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74F1071MTCX_NL
(Note 1)
MTC20
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide


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