800-900 MHz

+30 dBm Power GaAs FET

Page 4 of 4

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2006 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

CFK2062-P1

August 2006 - Rev 03-Aug-06

Ordering Information

The CFK2062-P1 power stage is available in a SO-8 surface mount package. Devices are available in tape and reel. Ordering part

numbers are listed.

Part Number for Ordering

Function

Package

CFK2062-P1

800 - 900 MHz Power Stage

SO-8 surface mount power package

CFK2062-P1-000T

800 - 900 MHz Power Stage

SO-8 surface mount power package in tape and reel

Thermal Considerations

The data shown was taken on a 31 mil thick FR-4 board with 1 ounce copper on both sides. The board was mounted to a base-

plate with 3 screws as shown. The screws bring the top side copper temperature to the same value as the baseplate. The thermal

resistance to the indicated reference lead,

, is 12°C/W. The thermal resistance to the reference screw is 14°C/W.

1. Use 1 or 2 ounce copper if possible.

2. Solder all eight leads of the CFK2062-P1 package to the appropriate electrical connection.

3. Solder the copper pad on the backside of the CFK2062-P1 package to the ground plane.

4. Use a large ground pad area with many plated through-holes as shown.

5. If possible, use at least one screw no more than 0.2 inches from the CFK2062-P1 package to provide a low thermal resistance

path to the baseplate of the package.