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ISL59831 Datasheet(PDF) 3 Page - Intersil Corporation

Part # ISL59831
Description  Single Supply Video Driver with Reconstruction Filter and Charge Pump
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL59831 Datasheet(HTML) 3 Page - Intersil Corporation

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3
FN6266.0
March 29, 2007
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VCC + 0.3V
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . ±50mA
Maximum Current into Any Pin . . . . . . . . . . . . . . . . . . . . . . . ±50mA
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3500V
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .350V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Notes 1, 2)
θJA (°C/W) θJC (°C/W)
4x3 TDFN Package . . . . . . . . . . . . . . .
41
3.5
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES:
1.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2.
θ
JC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
VCP = VCC = 3.3V, CF = 56nF ±20%, CS = 0.1µF ±20%, RFIL = 20Ω ±1%, CFIL = 0.22µF ±20%,
CIN = 0.1µF ±20%, RL = 150Ω, CL = 0pF, TA = +27°C, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
DC CHARACTERISTICS
VCC, VCP Supply Range
3.0
3.3
3.6
V
CPVEE
Charge Pump Output
-1.1
-1.9
-2.4
V
ICC
Supply Current
No load
4
6
8.5
mA
ICP
Charge Pump Supply
Current
No load
5
9
20
mA
IPD
Power Down Current
ENABLE = 0.4V
2
5
µA
IIN
Input Pulldown Current
VIN = 0.5V
0.5
2
4.5
µA
AV
DC Gain
1.9
2
2.06
V/V
VIN_MAX
Max DC Input Range
DC-Coupled Input, guaranteed by output linearity
1.4
V
VCLAMPOUT Output Sync Tip Clamp
Level
Sync height = 293mV, VIN ≤ 0, AC-coupled input
-500
-550
-600
mV
VCLAMPIN Input Clamp Level
Input floating
0
40
80
mV
VOS
Output Level Shift
Sync height = 293mV, VIN > 0, output shifted relative to input,
DC-coupled input
-530
-592
-650
mV
ICLAMP
Clamp Restore Current
Force VIN = -0.3V
2
3.9
mA
PSRRDC
Power Supply Rejection VCC = +3.0 to +3.6
35
50
dB
AC CHARACTERISTICS
APB
Passband Flatness
f = 100kHz to 5MHz relative to 100kHz
0
2
dB
ASB
Stopband Attenuation
f
≥ 27MHz relative to 100kHz
25
44
dB
dG
Differential Gain
5-step modulated staircase
0.4
%
dP
Differential Phase
5-step modulated staircase
0.35
°
SNR
Signal to Noise Ratio
Peak signal (1.4VP-P) to RMS noise, f = 10Hz to 50MHz
59
dB
ISL59831


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