9

FN7465.2

December 1, 2006

Typical Circuit

A typical application circuit is shown in Figure 12.

Suggested PCB Footprint

See Figure 13. Footprint pads should be a nominal 1-to-1

correspondence with package pads. The large, exposed

central die-mounting paddle in the center of the package

requires neither thermal nor electrical connection to the

PCB, and such connection should be avoided.

Layout Considerations

The ISL29002 is relatively insensitive to layout. Like other

even in significantly noisy environments. There are only a

few considerations that will ensure best performance.

sources of noise. Use two power-supply decoupling

capacitors, 4.7µF and 0.1µF, placed close to the device.

Soldering Considerations

Convection heating is recommended for reflow soldering;

direct-infrared heating is not recommended. The ISL29002’s

plastic ODFN package does not require a custom reflow

soldering profile, and is qualified to +260°C. A standard

reflow soldering profile with a +260°C maximum is

recommended.

Special Handling

ODFN8 is rated as JEDEC moisture level 4. Standard

JEDEC Level 4 procedure should be followed: 72hr floor life

at less than +30°C 60% RH. When baking the device, the

temperature required is +110°C or less due to special

molding compound.

ISL29002

VDD

VSS

REXT

A0

A1

A2

SDA

SCL

+

4.7µ

F

0.1µF

100k

MICROCONTROLLER

SDA

SCL

2.5-

3.3V

FIGURE 12. TYPICAL CIRCUIT

FIGURE 13. SUGGESTED PCB FOOTPRINT

(6x0.65)

(2.80 TYP)

(1.40)

(2.29)

(8x0.60)

(8x0.30)

ISL29002