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X28HC64EM-70 Datasheet(PDF) 3 Page - Intersil Corporation |
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X28HC64EM-70 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 17 page 3 FN8109.1 June 7, 2006 X28HC64D-12 X28HC64D-12 0 to 70 120 28 Ld CERDIP X28HC64DI-12 X28HC64DI-12 -40 to 85 28 Ld CERDIP X28HC64DM-12 X28HC64DM-12 -55 to 125 28 Ld CERDIP X28HC64DMB-12 C X28HC64DMB-12 MIL-STD-883 28 Ld CERDIP X28HC64FM-12 X28HC64FM-12 -55 to 125 28 Ld FLATPACK (440 mil) X28HC64J-12* X28HC64J-12 0 to 70 32 Ld PLCC N32.45x55 X28HC64JI-12* X28HC64JI-12 -40 to 85 32 Ld PLCC N32.45x55 X28HC64JIZ-12* (Note) X28HC64JI-12 Z -40 to 85 32 Ld PLCC (Pb-free) N32.45x55 X28HC64JZ-12* (Note) X28HC64J-12 Z 0 to 70 32 Ld PLCC (Pb-free) N32.45x55 X28HC64KMB-12 C X28HC64KMB-12 MIL-STD-883 28 Ld PGA G28.550x650A X28HC64P-12 X28HC64P-12 0 to 70 28 Ld PDIP E28.6 X28HC64PI-12 X28HC64PI-12 -40 to 85 28 Ld PDIP E28.6 X28HC64PIZ-12 (Note) X28HC64PI-12 Z -40 to 85 28 Ld PDIP** (Pb-free) E28.6 X28HC64PZ-12 (Note) X28HC64P-12 Z 0 to 70 28 Ld PDIP** (Pb-free) E28.6 X28HC64S-12* X28HC64S-12 0 to 70 28 Ld SOIC (300 mil) M28.3 X28HC64SI-12* X28HC64SI-12 -40 to 85 28 Ld SOIC (300 mil) M28.3 X28HC64SIZ-12* (Note) X28HC64SI-12 Z -40 to 85 28 Ld SOIC (300 mil) (Pb-free) M28.3 X28HC64SZ-12 (Note) X28HC64S-12 Z 0 to 70 28 Ld SOIC (300 mil) (Pb-free) M28.3 X28HC64DM-15 X28HC64DM-15 -55 to 125 150 28 Ld CERDIP X28HC64J-15T1 X28HC64J-15 0 to 70 32 Ld PLCC Tape and Reel N32.45x55 X28HC64JI-15 X28HC64JI-15 -40 to 85 32 Ld PLCC N32.45x55 X28HC64JM-15 X28HC64JM-15 -55 to 125 32 Ld PLCC N32.45x55 X28HC64JZ-15* (Note) X28HC64J-15 Z 0 to 70 32 Ld PLCC (Pb-free) N32.45x55 X28HC64KMB-15 C X28HC64KMB-15 MIL-STD-883 28 Ld PGA G28.550x650A X28HC64P-15 X28HC64P-15 0 to 70 28 Ld PDIP E28.6 X28HC64PIZ-15 (Note) X28HC64PI-15 Z -40 to 85 28 Ld PDIP** (Pb-free) E28.6 X28HC64PZ-15 (Note) X28HC64P-15 Z 0 to 70 28 Ld PDIP** (Pb-free) E28.6 X28HC64S-15 X28HC64S-15 0 to 70 28 Ld SOIC (300 mil) M28.3 X28HC64SI-15 X28HC64SI-15 -40 to 85 28 Ld SOIC (300 mil) M28.3 *Add "T1" suffix for tape and reel. **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Ordering Information (Continued) PART NUMBER PART MARKING TEMPERATURE RANGE (°C) ACCESS TIME (ns) PACKAGE PKG. DWG. # X28HC64 |
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