3

FN8109.1

June 7, 2006

X28HC64D-12

X28HC64D-12

0 to 70

120

28 Ld CERDIP

X28HC64DI-12

X28HC64DI-12

-40 to 85

28 Ld CERDIP

X28HC64DM-12

X28HC64DM-12

-55 to 125

28 Ld CERDIP

X28HC64DMB-12

C X28HC64DMB-12

MIL-STD-883

28 Ld CERDIP

X28HC64FM-12

X28HC64FM-12

-55 to 125

28 Ld FLATPACK (440 mil)

X28HC64J-12*

X28HC64J-12

0 to 70

32 Ld PLCC

N32.45x55

X28HC64JI-12*

X28HC64JI-12

-40 to 85

32 Ld PLCC

N32.45x55

X28HC64JIZ-12* (Note)

X28HC64JI-12 Z

-40 to 85

32 Ld PLCC (Pb-free)

N32.45x55

X28HC64JZ-12* (Note)

X28HC64J-12 Z

0 to 70

32 Ld PLCC (Pb-free)

N32.45x55

X28HC64KMB-12

C X28HC64KMB-12

MIL-STD-883

28 Ld PGA

G28.550x650A

X28HC64P-12

X28HC64P-12

0 to 70

28 Ld PDIP

E28.6

X28HC64PI-12

X28HC64PI-12

-40 to 85

28 Ld PDIP

E28.6

X28HC64PIZ-12 (Note)

X28HC64PI-12 Z

-40 to 85

28 Ld PDIP** (Pb-free)

E28.6

X28HC64PZ-12 (Note)

X28HC64P-12 Z

0 to 70

28 Ld PDIP** (Pb-free)

E28.6

X28HC64S-12*

X28HC64S-12

0 to 70

28 Ld SOIC (300 mil)

M28.3

X28HC64SI-12*

X28HC64SI-12

-40 to 85

28 Ld SOIC (300 mil)

M28.3

X28HC64SIZ-12* (Note)

X28HC64SI-12 Z

-40 to 85

28 Ld SOIC (300 mil) (Pb-free)

M28.3

X28HC64SZ-12 (Note)

X28HC64S-12 Z

0 to 70

28 Ld SOIC (300 mil) (Pb-free)

M28.3

X28HC64DM-15

X28HC64DM-15

-55 to 125

150

28 Ld CERDIP

X28HC64J-15T1

X28HC64J-15

0 to 70

32 Ld PLCC Tape and Reel

N32.45x55

X28HC64JI-15

X28HC64JI-15

-40 to 85

32 Ld PLCC

N32.45x55

X28HC64JM-15

X28HC64JM-15

-55 to 125

32 Ld PLCC

N32.45x55

X28HC64JZ-15* (Note)

X28HC64J-15 Z

0 to 70

32 Ld PLCC (Pb-free)

N32.45x55

X28HC64KMB-15

C X28HC64KMB-15

MIL-STD-883

28 Ld PGA

G28.550x650A

X28HC64P-15

X28HC64P-15

0 to 70

28 Ld PDIP

E28.6

X28HC64PIZ-15 (Note)

X28HC64PI-15 Z

-40 to 85

28 Ld PDIP** (Pb-free)

E28.6

X28HC64PZ-15 (Note)

X28HC64P-15 Z

0 to 70

28 Ld PDIP** (Pb-free)

E28.6

X28HC64S-15

X28HC64S-15

0 to 70

28 Ld SOIC (300 mil)

M28.3

X28HC64SI-15

X28HC64SI-15

-40 to 85

28 Ld SOIC (300 mil)

M28.3

*Add "T1" suffix for tape and reel.

**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

PART NUMBER

PART MARKING

TEMPERATURE

RANGE (°C)

ACCESS TIME

(ns)

PACKAGE

PKG. DWG. #

X28HC64