3

FN8113.1

May 11, 2006

X4003S8IZ-2.7A

(Note)

X4003 ZAP X4005S8IZ-2.7A

(Note)

X4005 ZAP

2.7 to 5.5

2.85 to 3.0

-40 to 85

8 Ld SOIC

(150 mil) (Pb-free)

MDP0027

X4003M8-2.7

ACN

X4005M8-2.7

ACW

2.55 to 2.7

0 to 70

8 Ld MSOP

(3.0mm)

M8.118

X4003M8Z-2.7

(Note)

DAF

X4005M8Z-2.7

(Note)

DAN

0 to 70

8 Ld MSOP

(3.0mm) (Pb-free)

M8.118

X4003M8I-2.7

ACO

X4005M8I-2.7

ACX

-40 to 85

8 Ld MSOP

(3.0mm)

M8.118

X4003M8IZ-2.7

(Note)

DAB

X4005M8IZ-2.7

(Note)

DAK

-40 to 85

8 Ld MSOP

(3.0mm) (Pb-free)

M8.118

X4003S8-2.7

X4003 F

X4005S8-2.7

X4005 F

0 to 70

8 Ld SOIC

(150 mil)

MDP0027

X4003S8Z-2.7

(Note)

X4003 ZF

X4005S8Z-2.7

(Note)

X4005 ZF

0 to 70

8 Ld SOIC

(150 mil) (Pb-free)

MDP0027

X4003S8I-2.7

X4003 G

X4005S8I-2.7

X4005 G

-40 to 85

8 Ld SOIC

(150 mil)

MDP0027

X4003S8IZ-2.7

(Note)

X4003 ZG

X4005S8IZ-2.7

(Note)

X4005 ZG

-40 to 85

8 Ld SOIC

(150 mil) (Pb-free)

MDP0027

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

PART NUMBER

RESET

(ACTIVE LOW)

PART

MARKING

PART NUMBER

RESET

(ACTIVE HIGH)

PART

MARKING

(V)

(V)

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

X4003, X4005