2

FN8173.4

April 17, 2007

Ordering Information

PART NUMBER

PART

MARKING

(V)

POTENTIOMETER

ORGANIZATION

(k

Ω)

TEMP

RANGE

(°C)

PACKAGE

PKG.

DWG. #

X9269TS24*

X9269TS

5 ±10%

100

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9269TS24I*

X9269TS I

-40 to +85 24 Ld SOIC (300 mil)

M24.3

X9269TS24IZ* (Note)

X9269TS ZI

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269TS24Z* (Note)

X9269TS Z

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269TV24

X9269TV

0 to +70

24 Ld TSSOP (4.4mm)

MDP0044

X9269US24*

X9269US

50

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9269US24I*

X9269US I

-40 to +85 24 Ld SOIC (300 mil)

M24.3

X9269US24IZ* (Note)

X9269US ZI

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269US24Z* (Note)

X9269US Z

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269UV24*

X9269UV

0 to +70

24 Ld TSSOP (4.4mm)

MDP0044

X9269UV24I

X9269UV I

-40 to +85 24 Ld TSSOP (4.4mm)

MDP0044

X9269TS24-2.7*

X9269TS F

2.7 to 5.5

100

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9269TS24I-2.7*

X9269TS G

-40 to +85 24 Ld SOIC (300 mil)

M24.3

X9269TS24IZ-2.7* (Note)

X9269TS ZG

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269TS24Z-2.7* (Note)

X9269TS ZF

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269TV24I-2.7

X9269TV G

-40 to +85 24 Ld TSSOP (4.4mm)

MDP0044

X9269TV24IZ-2.7* (Note)

X9269TV ZG

-40 to +85 24 Ld TSSOP (4.4mm)

(Pb-free)

MDP0044

X9269US24-2.7*

X9269US F

50

0 to +70

24 Ld SOIC (300 mil)

M24.3

X9269US24I-2.7*

X9269US G

-40 to +85 24 Ld SOIC (300 mil)

M24.3

X9269US24IZ-2.7* (Note)

X9269US ZG

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269US24Z-2.7* (Note)

X9269US ZF

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

M24.3

X9269UV24-2.7*

X9269UV F

0 to +70

24 Ld TSSOP (4.4mm)

MDP0044

X9269UV24I-2.7*

X9269UV G

-40 to +85 24 Ld TSSOP (4.4mm)

MDP0044

X9269UV24IZ-2.7*

X9269UV ZG

-40 to +85 24 Ld TSSOP (4.4mm)

MDP0044

*Add "T1" suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

X9269