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ISL6209 Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL6209 Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 10 page 4 Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltage (VDELAY, VPWM) . . . . . . . . . . . . -0.3V to VCC + 0.3V BOOT Voltage (VBOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V BOOT To PHASE Voltage (VBOOT-PHASE) . . . . . . -0.3V to 7V (DC) -0.3V to 9V (<10ns) PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V GND - 8V (<20ns Pulse Width, 10 μJ) UGATE Voltage . . . . . . . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT VPHASE - 5V (<20ns Pulse Width, 10μJ) to VBOOT LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V GND - 2.5V (<20ns Pulse Width, 5 μJ) to VCC + 0.3V Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10% Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) SOIC Package (Note 2) . . . . . . . . . . . . 110 N/A QFN Package (Notes 3, 4). . . . . . . . . . 80 15 Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND. 2. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VCC SUPPLY CURRENT Bias Supply Current IVCC PWM pin floating, VVCC = 5V - 85 - μA POR Rising -3.4 4.2 V POR Falling 2.2 2.9 - V Hysteresis - 500 - mV BOOTSTRAP DIODE Forward Voltage VF VVCC = 5V, forward bias current = 2mA 0.40 0.52 0.60 V PWM INPUT Input Current IPWM VPWM = 5V - 250 - μA VPWM = 0V - -250 - μA PWM Three-State Rising Threshold VVCC = 5V - - 1.8 V PWM Three-State Falling Threshold VVCC = 5V 3.1 - - V Three-State Shutdown Hold-off Time VVCC = 5V, temperature = +25°C - 150 - ns SWITCHING TIME UGATE Rise Time (Note 5) tRUGATE VVCC = 5V, 3nF Load - 8 - ns LGATE Rise Time (Note 5) tRLGATE VVCC = 5V, 3nF Load - 8 - ns UGATE Fall Time (Note 5) tFUGATE VVCC = 5V, 3nF Load - 8 - ns LGATE Fall Time (Note 5) tFLGATE VVCC = 5V, 3nF Load - 4 - ns UGATE Turn-Off Propagation Delay tPDLUGATE VVCC = 5V, No Output Load, DELAY = VCC - 13 - ns LGATE Turn-Off Propagation Delay tPDLLGATE VVCC = 5V, No Output Load, DELAY = VCC - 13 - ns UGATE Turn-On Propagation Delay tPDHUGATE VVCC = 5V, Outputs Unloaded, DELAY = VCC 10 20 30 ns ISL6209 |
Similar Part No. - ISL6209_07 |
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Similar Description - ISL6209_07 |
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