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TPS61052YZGT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS61052YZGT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 45 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS TPS61050 TPS61052 SLUS525 – MARCH 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS SAFETY TIMER TA PART NUMBER(1) PACKAGE MARKING PACKAGE MAXIMUM DURATION TPS61050YZG 1.02 s 61050 CSP-12 TPS61050DRC 1.02 s BRV QFN-10 –40 °C to 85°C TPS61052YZG 1.02 s 61052 CSP-12 TPS61052DRC 1.02 s BRW QFN-10 (1) The YZG package is available in tape and reel. Add R suffix (TPS6105xYZGR, TPS6105xDRCR) to order quantities of 3000 parts. Add T suffix (TPS6105xYZGT, TPS6105xDRCT) to order quantities of 250 parts. over operating free-air temperature range (unless otherwise noted)(1) TPS6105X UNIT Voltage range on AVIN, VOUT, SW, LED (2) –0.3 to 7 V Voltage range on SCL, SDA, FLASH_SYNC, GPIO, ENVM (2) –0.3 to 7 V Input current on GPIO 25 mA TA Operating ambient temperature range (3) –40 to 85 °C TJ (MAX) Maximum operating junction temperature 150 °C Tstg Storage temperature range –65 to 150 °C Human body model 2 kV ESD Charge device model 1 kV rating(4) Machine model 200 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application ( θ JA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). (4) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. DERATING FACTOR POWER RATING PACKAGE THERMAL RESISTANCE(1)(2) ABOVE(1)(2) TA = 25°C TA = 25°C YZG θ JA= 89°C/W θ JB= 35°C/W 1.1 W 12 mW/ °C DRC θ JA= 49°C/W θ JC= 3.2°C/W 2.4 W 20 mW/ °C (1) Measured with high-K board. (2) Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max)–TA)/ θJA. 2 Submit Documentation Feedback |
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