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TMP411BDGKTG4 Datasheet(PDF) 6 Page - Burr-Brown (TI) |
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TMP411BDGKTG4 Datasheet(HTML) 6 Page - Burr-Brown (TI) |
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6 / 28 page  TMP411 SBOS383A − FEBRUARY 2007 www.ti.com 6 APPLICATIONS INFORMATION The TMP411 is a dual-channel digital temperature sensor that combines a local die temperature measurement channel and a remote junction temperature measurement channel in a single MSOP-8 or SO-8 package. The TMP411 is Two-Wire- and SMBus interface-compatible and is specified over a temperature range of −40 °C to +125 °C. The TMP411 contains multiple registers for holding configuration information, temperature measurement results, temperature comparator maximum/minimum limits, and status information. User-programmed high and low temperature limits stored in the TMP401 can be used to monitor local and remote temperatures to trigger an over/under temperature alarm (ALERT). Additional thermal limits can be programmed into the TMP411 and used to trigger another flag (THERM) that can be used to initiate a system response to rising temperatures. The TMP411 requires only a transistor connected between D+ and D− for proper remote temperature sensing operation. The SCL and SDA interface pins require pull-up resistors as part of the communication bus, while ALERT and THERM are open-drain outputs that also need pull−up resistors. ALERT and THERM may be shared with other devices if desired for a wired-OR implementation. A 0.1 µF power-supply bypass capacitor is recommended for good local bypassing. Figure 11 shows a typical configuration for the TMP411. 0.1 µF 10k Ω (typ) 10k Ω (typ) 10k Ω (typ) 10k Ω (typ) TMP411 D+ D − V+ 1 8 7 6 4 5 3 2 R S (2) R S (2) C DIFF (3) C DIFF (3) R S (2) R S (2) GND SCL SDA ALERT/THERM2 THERM +5V SMBus Controller Fan Controller Diode−connected configuration(1): Series Resistance Transistor−connected configuration(1): (1) Diode−connected configuration provides better settling time. Transistor−connected configuration provides better series resistance cancellation. (2) R S should be < 1.5kΩ in most applications. (3) C DIFF should be < 1000pF in most applications. NOTES: Figure 11. Basic Connections |
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