2000 Jan 13

14

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

BONDING PAD LOCATIONS

Note

1. All coordinates (

µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

SYMBOL

PAD

xy

TXD

1

196

135

GND

2

1280

135

3

1767

135

RXD

4

2588

135

5

2594

1640

CANL

6

1689

1640

CANH

7

948

1640

Rs

8

196

1640

handbook, full pagewidth

PCA82C250U

1

8

7

6

5

2

34

MGL945

y

2.79 mm

x

0

0

1.78

mm

Fig.12 Bonding pad locations.