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TLV2475CDR Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2475CDR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 53 page ® ® www.ti.com FEATURES DESCRIPTION TLV2470 ,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA SLOS232D – JUNE 1999 – REVISED FEBRUARY 2007 FAMILY OF 600 µA/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN • CMOS Rail-To-Rail Input/Output The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new • Input Bias Current: 2.5pA performance point for supply current versus ac • Low Supply Current: 600µA/Channel performance. These devices consume just • Ultra-Low Power Shutdown Mode 600 µA/channel while offering 2.8MHz of IDD(SHDN): 350nA/ch at 3V gain-bandwidth product. Along with increased ac IDD(SHDN): 1000nA/ch at 5V performance, the amplifier provides high output drive capability, solving a major shortcoming of older • Gain-Bandwidth Product: 2.8MHz micropower operational amplifiers. The TLV247x can • High Output Drive Capability swing to within 180mV of each supply rail while – ±10mA at 180mV driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. – ±35mA at 500mV Both the inputs and outputs swing rail-to-rail for • Input Offset Voltage: 250µV (typ) increased dynamic range in low-voltage applications. • Supply Voltage Range: 2.7V to 6V This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, • Ultra-Small Packaging and other data acquisition circuits. – SOT23-5 or -6 (TLV2470/1) – MSOP-8 or -10 (TLV2472/3) FAMILY PACKAGE TABLE PACKAGE TYPES NUMBER OF DEVICE SHUTDOWN UNIVERSAL EVM BOARD CHANNELS PDIP SOIC SOT23 TSSOP MSOP TLV2470 1 8 8 6 — — Yes TLV2471 1 8 8 5 — — — TLV2472 2 8 8 — — 8 — Refer to the EVM Selection Guide (SLOU060) TLV2473 2 14 14 — — 10 Yes TLV2474 4 14 14 — 14 — — TLV2475 4 16 16 — 16 — Yes A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS(1) VDD VIO BW SLEW RATE IDD (per channel) DEVICE OUTPUT DRIVE RAIL-TO-RAIL (V) ( µV) (MHz) (V/ µs) ( µA) TLV247X 2.7 – 6.0 250 2.8 1.5 600 ±35mA I/O TLV245X 2.7 – 6.0 20 0.22 0.11 23 ±10mA I/O TLV246X 2.7 – 6.0 150 6.4 1.6 550 ±90mA I/O TLV277X 2.5 – 6.0 360 5.1 10.5 1000 ±10mA O (1) All specifications measured at 5 V. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Microsim PARTS is a trademark of MicroSim Corporation. Microsim PSpice is a registered trademark of MicroSim Corporation. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 1999–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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