Analog Integrated Circuit Device Data

Freescale Semiconductor

11

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REVISION HISTORY

REVISION HISTORY

REVISION

DATE

DESCRIPTION OF CHANGES

7.0

5/2006

•

Implemented Revision History page

•

Converted to Freescale format

8.0

11/2006

•

Updated data sheet format

•

Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from

Maximum Ratings on page 4. Added note with instructions to obtain this information from

www.freescale.com.

9.0

11/2006

•

Minor correction changes to Figure 1 and ordering information

10.0

12/2006

•

Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC

standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels

(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter

the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on

page 4