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MPC5553MZP80 Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc |
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MPC5553MZP80 Datasheet(HTML) 8 Page - Freescale Semiconductor, Inc |
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8 / 66 page  MPC5553 Microcontroller Data Sheet, Rev. 2.0 Electrical Characteristics Freescale Semiconductor 8 RθJC is device related and is not affected by other factors. The thermal environment can be controlled to change the case-to-ambient thermal resistance, RθCA. For example, change the air flow around the device, add a heat sink, change the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to the heat sink to ambient. For most packages, a better model is required. A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple estimations and for computational fluid dynamics (CFD) thermal models. To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization parameter ( ΨJT) to determine the junction temperature by measuring the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) where: TT = thermocouple temperature on top of the package (oC) ΨJT = thermal characterization parameter (oC/W) PD = power dissipation in the package (W) The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests on the package. A small amount of epoxy is placed on the thermocouple junction and approximately 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by the cooling effects of the thermocouple wire. References: Semiconductor Equipment and Materials International 805 East Middlefield Rd. Mountain View, CA., 94043 (415) 964-5111 MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956. JEDEC specifications are available on the web at http://www.jedec.org. • 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54. • 2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic Packaging and Production, pp. 53–58, March 1998. • 3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220. |
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