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C1632C82111RAC Datasheet(PDF) 11 Page - Kemet Corporation |
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C1632C82111RAC Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 30 page ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP/CAPACITORS Tin Lead L Termination C 0805 C 103 K 5 R A L* CERAMIC SIZE CODE SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads (pF) First two digits represent significant figures. Third digit specifies number of zeros. (Use 9 for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF) (Example: 2.2pF = 229 or 0.50 pF = 508) CAPACITANCE TOLERANCE B – ±0.10pF J – ±5% C – ±0.25pF K – ±10% D – ±0.5pF M – ±20% F – ±1% G – ±2% L # W # B S MOUNTING LENGTH WIDTH BANDWIDTH MIN. SEPARATION TECHNIQUE 1.0 (.04) ± .05(.002) 0.5 (.02) ± .05 (.002) 0.20 (0.008)-0.40 (0.016) 0.3 (.012) Solder Reflow 1.6 (.063) ± 0.15 (.006) 0.8 (.032) ± 0.15 (.006) 0.35 (.014) ±0.15 (.006) 0.7 (.028) 2.0 (.079) ± 0.2 (.008) 1.25 (.049) ± 0.2 (.008) 0.5 (.02) ±.25 (.010) 0.75 (.030) Solder Wave † 3.2 (.126) ± 0.2 (.008) 1.6 (.063) ± 0.2 (.008) 0.5 (.02) ±.25 (.010) N/A Solder Reflow 3.2 (.126) ± 0.2 (.008) 2.5 (.098) ± 0.2 (.008) 0.5 (.02) ±.25 (.010) N/A 4.5 (.177) ± 0.3 (.012) 3.2 (.126) ± 0.3 (.012) 0.6 (.024) ±.35 (.014) N/A 4.5 (.177) ± 0.3 (.012) 6.4 (.252) ± 0.4 (.016) 0.6 (.024) ±.35 (.014) N/A 5.6 (.220) ± 0.4 (.016) 5.0 (.197) ± 0.4 (.016) 0.6 (.024) ±.35 (.014) N/A 5.6 (.220) ± 0.4 (.016) 6.3 (.248) ± 0.4 (.016) 0.6 (.024) ±.35 (.014) N/A DIMENSIONS—MILLIMETERS AND (INCHES) CAPACITOR ORDERING INFORMATION CAPACITOR OUTLINE DRAWINGS END METALLIZATION L - SnPb plated nickel barrier (SnPb 5% minimum) FAILURE RATE LEVEL A- Not Applicable TEMPERATURE CHARACTERISTIC Designated by Capacitance Change Over Temperature Range G – C0G (NP0) (±30 PPM/°C) R – X7R (±15%) (-55°C + 125°C) P – X5R (±15%) (-55°C + 85°C) VOLTAGE 1 - 100V 3 - 25V 2 - 200V 4 - 16V 5 - 50V 8 - 10V 9 - 6.3V * Part Number Example: C0805C103K5RAL (14 digits - no spaces) * Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.) † For extended value 1210 case size – solder reflow only. or Solder Reflow METRIC SIZE CODE (Ref only) 1005 1608 2012 3216 3225 4532 4564 5650 5664 EIA SIZE CODE 0402* 0603* 0805* 1206* 1210* 1812 1825* 2220 2225 (Standard Chips - For Military see page 8 7) See page 7 8 for thickness dimensions. KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead elec- troplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for our valued high reliability and military customers. KEMET Tiin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard capacitance values in X7R, X5R, C0G dielectrics. Voltage ratings range from 6.3V to 200V. To order the Tin/Lead termina- tions indicate an “L” in the 14th digit of the part number. For additional dielectrics and voltage ratings please contact the fac- tory or local Sales personnel. FEATURES Refer to pages 73-76 for NP0/C0G, X7R and X5R dielectric capacitance ranges available. W L B S T CONDUCTIVE METALLIZATION ELECTRODES Sn/Pb PLATE NICKEL PLATE KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard capacitance values in X7R and C0G dielectrics. Voltage ratings range from 6.3V to 200V. To order the Tin/Lead terminations indicate an “L” in the 14th digit of the part number. To request the L Series termination for other surface mount product lines (Open Mode, High Voltage, Arrays, etc.) or for additional dielectrics and higher voltage ratings, please contact the factory or local Sales representative. 77 |
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