BAS16J_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 8 March 2007

7 of 10

NXP Semiconductors

BAS16J

Single high-speed switching diode

9.

Package outline

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

11. Soldering

Fig 7.

Package outline SOD323F (SC-90)

04-09-13

Dimensions in mm

0.80

0.65

0.25

0.10

0.5

0.3

2.7

2.3

1.8

1.6

0.40

0.25

1.35

1.15

1

2

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

BAS16J

SOD323F

4 mm pitch, 8 mm tape and reel

-115

-135

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 8.

Reflow soldering footprint SOD323F (SC-90)

001aab169

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste