BAS16VV_BAS16VY_3

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 — 20 April 2007

8 of 12

NXP Semiconductors

BAS16VV; BAS16VY

Triple high-speed switching diodes

11. Soldering

Reflow soldering is the only recommended soldering method.

Fig 9.

Reflow soldering footprint SOT666

solder lands

solder resist

placement area

occupied area

0.075

Dimensions in mm

2.75

2.45

2.10

1.60

1.20

2.20

2.50

2.00 1.70 1.00

0.30 (2

×)

0.15

(4

×)

0.375

(4

×)

0.40

(6

×)

0.55

(2

×)