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C0402C758D4PAC Datasheet(PDF) 1 Page - Kemet Corporation |
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C0402C758D4PAC Datasheet(HTML) 1 Page - Kemet Corporation |
1 / 9 page ![]() ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP CAPACITORS C 0805 C 103 K 5 R A C* CERAMIC SIZE CODE SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads (pF) First two digits represent significant figures. Third digit specifies number of zeros. (Use 9 for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF) (Example: 2.2pF = 229 or 0.50 pF = 508) CAPACITANCE TOLERANCE B – ±0.10pF J – ±5% C – ±0.25pF K – ±10% D – ±0.5pF M – ±20% F – ±1% P – (GMV) – special order only G – ±2% Z – +80%, -20% DIMENSIONS—MILLIMETERS AND (INCHES) CAPACITOR ORDERING INFORMATION • C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and +80%-20% • Tape and reel packaging per EIA481-1. (See page 92 for specific tape and reel information.) Bulk Cassette packaging (0402, 0603, 0805 only) per IEC60286-6 and EIAJ 7201. • RoHS Compliant FEATURES CAPACITOR OUTLINE DRAWINGS END METALLIZATION C-Standard (Tin-plated nickel barrier) FAILURE RATE LEVEL A- Not Applicable TEMPERATURE CHARACTERISTIC Designated by Capacitance Change Over Temperature Range G – C0G (NP0) (±30 PPM/°C) R – X7R (±15%) (-55°C + 125°C) P– X5R (±15%) (-55°C + 85°C) U – Z5U (+22%, -56%) (+10°C + 85°C) V – Y5V (+22%, -82%) (-30°C + 85°C) VOLTAGE 1 - 100V 3 - 25V 2 - 200V 4 - 16V 5 - 50V 8 - 10V W L T B S TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION ELECTRODES * Part Number Example: C0805C103K5RAC (14 digits - no spaces) or Solder Reflow METRIC SIZE CODE (Ref only) 1005 1608 2012 3216 3225 4532 4564 5650 5664 EIA SIZE CODE 0402* 0603* 0805* 1206* 1210* 1812 1825* 2220 2225 (Standard Chips - For Military see page 87) 9 - 6.3V 7 - 4V EIA SIZE CODE METRIC SIZE CODE L - LENGTH W - WIDTH T THICKNESS B - BANDWIDTH S SEPARATION minimum MOUNTING TECHNIQUE 0201* 0603 0.6 (.024) ± .03 (.001) 0.3 ± (.012) ± .03 (.001) 0.15 (.006) ± .05 (.002) N/A 0402* 1005 1.0 (.04) ± .05 (.002) 0.5 (.02) ± .05 (.002) 0.20 (.008) -.40 (.016) 0.3 (.012) 0603 1608 1.6 (.063) ± .15 (.006) 0.8 (.032) ± .15 (.006) 0.35 (.014) ± .15 (.006) 0.7 (.028) 0805* 2012 2.0 (.079) ± .20 (.008) 1.25 (.049) ± .20 (.008) 0.50 (.02) ± .25 (.010) 0.75 (.030) 1206* 3216 3.2 (.126) ± .20 (.008) 1.6 (.063) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A 1210* 3225 3.2 (.126) ± .20 (.008) 2.5 (.098) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A 1812 4532 4.5 (.177) ± .30 (.012) 3.2 (.126) ± .30 (.012) 0.60 (.024) ± .35 (.014) N/A 1825* 4564 4.5 (.177) ± .30 (.012) 6.4 (.252) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A 2220 5650 5.6 (.220) ± .40 (.016) 5.0 (.197) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A 2225 5664 5.6 (.220) ± .40 (.016) 6.3 (.248) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A * Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.) + For extended value 1210 case size - solder reflow only. Solder Wave + or Solder Reflow Solder Reflow See page 7 8 for thickness dimensions. Solder Reflow 72 |
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