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Sheet No.: D3-A02101EN

GP2S60

● Soldering Method

Reflow Soldering:

Reflow soldering should follow the temperature profile shown below.

Soldering should not exceed the curve of temperature profile and time.

Please solder within one time.

Other notice

Please take care not to let any external force exert on lead pins.

Please test the soldering method in actual condition and make sure the soldering works fine, since the

impact on the junction between the device and PCB varies depending on the cooling and soldering

conditions.

● Cleaning instructions

Solvent cleaning :

Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.

Ultrasonic cleaning :

Do not execute ultrasonic cleaning.

Recommended solvent materials :

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.

MAX

240˚C

MAX

160˚C

200˚C

25˚C

1 to 4˚C/s

MAX120s

MAX10s

MAX60s

MAX90s

1 to 4˚C/s

1 to 4˚C/s