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APTGF300U120DG Datasheet(PDF) 3 Page - Microsemi Corporation |
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APTGF300U120DG Datasheet(HTML) 3 Page - Microsemi Corporation |
3 / 5 page APTGF300U120DG www.microsemi.com 3 – 5 Thermal and package characteristics Symbol Characteristic Min Typ Max Unit IGBT 0.07 RthJC Junction to Case Thermal Resistance Diode 0.12 °C/W VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V TJ Operating junction temperature range -40 150 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 °C To heatsink M6 3 5 Torque Mounting torque For terminals M5 2 3.5 N.m Wt Package Weight 280 g SP6 Package outline (dimensions in mm) See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com |
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