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APTGT50TA170PG Datasheet(PDF) 3 Page - Microsemi Corporation |
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APTGT50TA170PG Datasheet(HTML) 3 Page - Microsemi Corporation |
3 / 5 page APTGT50TA170PG www.microsemi.com 3 - 5 Thermal and package characteristics Symbol Characteristic Min Typ Max Unit IGBT 0.4 RthJC Junction to Case Thermal Resistance Diode 0.7 °C/W VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 3500 V TJ Operating junction temperature range -40 150 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 °C Torque Mounting torque To heatsink M6 3 5 N.m Wt Package Weight 250 g SP6-P Package outline (dimensions in mm) 5 places (3:1) See application note 1902 - Mounting Instructions for SP6-P (12mm) Power Modules on www.microsemi.com |
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