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TCM810LVN Datasheet(PDF) 8 Page - Microchip Technology |
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TCM810LVN Datasheet(HTML) 8 Page - Microchip Technology |
8 / 16 page TCM809/TCM810 DS21661D-page 8 © 2005 Microchip Technology Inc. 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) 10 5 0 10 5 0 β Mold Draft Angle Bottom 10 5 0 10 5 0 α Mold Draft Angle Top 0.51 0.44 0.37 .020 .017 .015 B Lead Width 0.18 0.14 0.09 .007 .006 .004 c Lead Thickness 10 5 0 10 5 0 φ Foot Angle 0.55 0.45 0.35 .022 .018 .014 L Foot Length 3.04 2.92 2.80 .120 .115 .110 D Overall Length 1.40 1.30 1.20 .055 .051 .047 E1 Molded Package Width 2.64 2.37 2.10 .104 .093 .083 E Overall Width 0.10 0.06 0.01 .004 .002 .000 A1 Standoff § 1.02 0.95 0.88 .040 .037 .035 A2 Molded Package Thickness 1.12 1.01 0.89 .044 .040 .035 A Overall Height 1.92 .076 p1 Outside lead pitch (basic) 0.96 .038 p Pitch 3 3 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 2 1 p D B n E E1 L c β φ α A2 A A1 p1 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 § Significant Characteristic |
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