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MAX1963 Datasheet(PDF) 7 Page - Maxim Integrated Products |
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MAX1963 Datasheet(HTML) 7 Page - Maxim Integrated Products |
7 / 12 page Internal P-Channel Pass Transistor The MAX1963/MAX1976 feature a 0.33 Ω (RDS(ON)) P-channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P-channel MOSFETs require no base drive, which reduces quies- cent current. PNP-based regulators also waste consid- erable current in dropout when the pass transistor saturates and use high base-drive currents under large loads. The MAX1963/MAX1976 do not suffer from these problems and consume only 90µA (typ) of quiescent current under heavy loads, as well as in dropout. Shutdown Pull SHDN low to enter shutdown. During shutdown, the output is disconnected from the input, an internal 1.5k Ω resistor pulls OUT to GND, RESET is actively pulled low, and the supply current drops below 1µA. RESET Output The MAX1963/MAX1976 microprocessor (µP) supervisory circuitry asserts a guaranteed logic-low reset during power-up, power-down, and brownout conditions down to +1V. RESET asserts when VOUT is below the reset threshold and remains asserted for at least tRP after VOUT rises above the reset threshold of regulation. Current Limit The MAX1963/MAX1976 monitor and control the pass transistor’s gate voltage, limiting the output current to 450mA (min). If the output exceeds ILIM, the MAX1963/ MAX1976 output voltage drops. Thermal-Overload Protection Thermal-overload protection limits total power dissipa- tion in the MAX1963/MAX1976. When the junction tem- perature exceeds TJ = +165°C, a thermal sensor turns off the pass transistor, allowing the IC to cool. The ther- mal sensor turns the pass transistor on again after the junction temperature cools by 15°C, resulting in a pulsed output during continuous thermal-overload con- ditions. Thermal-overload protection safeguards the MAX1963/MAX1976 in the event of fault conditions. For continuous operation, do not exceed the absolute maxi- mum junction-temperature rating of TJ = +150°C. Operating Region and Power Dissipation The MAX1963/MAX1976 maximum power dissipation depends on the thermal resistance of the IC package and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipated in the device is P = IOUT ✕ (VIN - VOUT). The maximum allowed power dissipation is: PMAX = (TJ(MAX) - TA) / ( θJC + θCA) where (TJ(MAX) - TA) is the temperature difference between the MAX1963/MAX1976 die junction and the surrounding air, θJC is the thermal resistance of the junction to the case, and θCA is the thermal resistance from the case through the PC board, copper traces, and other materials to the surrounding air. For best heatsinking, expand the copper connected to the exposed paddle or GND. Low-Input-Voltage, 300mA LDO Regulators with RESET in SOT and TDFN _______________________________________________________________________________________ 7 MAXIMUM OUTPUT CURRENT vs. INPUT VOLTAGE (POWER DISSIPATION LIMIT) (VIN - VOUT) (V) 2.5 2.0 1.5 1.0 0.5 100 200 300 400 0 03.0 MAXIMUM RECOMMENDED OUTPUT CURRENT 6-PIN SOT23 TA = +85 °C TA = +70 °C Figure 2. Power Operating Regions for the 6-Pin SOT23: Maximum Output Current vs. Input Voltage MAXIMUM OUTPUT CURRENT vs. INPUT VOLTAGE (POWER DISSIPATION LIMIT) (VIN - VOUT) (V) 2.5 2.0 1.5 1.0 0.5 100 200 300 400 0 03.0 MAXIMUM RECOMMENDED OUTPUT CURRENT 6-PIN TDFN TA = +85 °C Figure 3. Power Operating Regions for the 6-Pin TDFN: Maximum Output Current vs. Input Voltage |
Similar Part No. - MAX1963_07 |
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Similar Description - MAX1963_07 |
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