PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-9051601M2A

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

5962-9051601MRA

ACTIVE

CDIP

J

20

1

TBD

Call TI

N / A for Pkg Type

5962-9051601MSA

ACTIVE

CFP

W

20

1

TBD

A42

N / A for Pkg Type

SN74BCT374DBLE

OBSOLETE

SSOP

DB

20

TBD

Call TI

Call TI

SN74BCT374DBR

OBSOLETE

SSOP

DB

20

TBD

Call TI

Call TI

SN74BCT374DW

ACTIVE

SOIC

DW

20

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374DWE4

ACTIVE

SOIC

DW

20

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374DWG4

ACTIVE

SOIC

DW

20

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374DWR

ACTIVE

SOIC

DW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374DWRG4

ACTIVE

SOIC

DW

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374N

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74BCT374NE4

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74BCT374NSR

ACTIVE

SO

NS

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374NSRE4

ACTIVE

SO

NS

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74BCT374NSRG4

ACTIVE

SO

NS

20

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SNJ54BCT374FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54BCT374J

ACTIVE

CDIP

J

20

1

TBD

Call TI

N / A for Pkg Type

SNJ54BCT374W

ACTIVE

CFP

W

20

1

TBD

A42

N / A for Pkg Type

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

17-Aug-2007

Addendum-Page 1