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DEVICE INFORMATION

ABSOLUTE MAXIMUM RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

THERMAL CHARACTERISTICS

TRF3703

SLWS184D – MARCH 2006 – REVISED JUNE 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

BBIN

22

I

In-phase input

BBIP

21

I

In-phase input

BBQN

9

I

In-quadrature input

BBQP

10

I

In-quadrature input

2, 5, 8,11,

GND

12, 14, 17,

–

Ground

19, 20, 23

LON

4

I

Local oscillator input

LOP

3

I

Local oscillator input

1, 6, 7, 13,

NC

–

No connect

15

RF_OUT

16

O

RF output

VCC

18, 24

–

Power supply

over operating free-air temperature range (unless otherwise noted)

UNIT

Supply voltage range

–0.3 V to 6

V

Digital I/O voltage range

V

Operating virtual junction temperature range

–40 to 150

°C

Operating ambient temperature range

–40 to 85

°C

Storage temperature range

–65 to 150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power-supply voltage

4.5

5

5.5

V

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Thermal resistance, junction-to-ambient

High-K board, still air

64.33

°C/W

Thermal resistance, junction-to-case

49.3

°C/W

3

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