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ADS1625IPAPR Datasheet(PDF) 2 Page - Texas Instruments |
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ADS1625IPAPR Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 37 page  ADS1625 ADS1626 SBAS280E − JUNE 2003 − REVISED MAY 2007 www.ti.com 2 ORDERING INFORMATION PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS1625 HTQFP−64 PAP −40 °C to +85°C ADS1625I ADS1625IPAPT Tape and Reel, 250 ADS1625 HTQFP−64 PAP −40 °C to +85°C ADS1625I ADS1625IPAPR Tape and Reel, 1000 ADS1626 HTQFP−64 PAP −40 °C to +85°C ADS1626I ADS1626IPAPT Tape and Reel, 250 ADS1626 HTQFP−64 PAP −40 °C to +85°C ADS1626I ADS1626IPAPR Tape and Reel, 1000 (1) For the most current specifications and package information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) ADS1625/26 UNIT AVDD to AGND −0.3 to +6 V DVDD to DGND −0.3 to +3.6 V IOVDD to DGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V Input Current 100, Momentary mA Input Current 10, Continuous mA Analog I/O to AGND −0.3 to AVDD + 0.3 V Digital I/O to DGND −0.3 to IOVDD + 0.3 V Maximum Junction Temperature +150 °C Operating Temperature Range −40 to +105 °C Storage Temperature Range −60 to +150 °C Lead Temperature (soldering, 10s) +260 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. PRODUCT FAMILY PRODUCT RESOLUTION DATA RATE FIFO? ADS1605 16 Bits 5.0MSPS No ADS1606 16 Bits 5.0MSPS Yes ADS1625 18 Bits 1.25MSPS No ADS1626 18 Bits 1.25MSPS Yes This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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