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SKY65028-70LF Datasheet(PDF) 6 Page - Skyworks Solutions Inc. |
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SKY65028-70LF Datasheet(HTML) 6 Page - Skyworks Solutions Inc. |
6 / 8 page Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com July 31, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200445 Rev. B DATA SHEET • SKY65028-70LF 6 Evaluation Board Description The Skyworks SKY65028-70LF Evaluation Board is used to test the performance of the SKY65028-70LF power amplifier driver. The following design considerations are general in nature and must be followed regardless of final use or configuration. 1. Paths to ground should be made as short as possible. 2. The ground pad of the SKY65028-70LF power amplifier has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as pos- sible from the amplifier. As such, design the connection to the ground pad to dissipate the maximum wattage produced to the circuit board. Multiple vias to the grounding layer are required. NOTE: Junction temperature (TJ) of the device increases with a poor connection to the slug and ground. This reduces the lifetime of the device. Testing Procedure Use the following procedure to set up the SKY65028-70LF Evaluation Board for testing: 1. Connect a 5.0 V supply to VCC. If available, enable the current limiting function of the power supply to 240 mA. 2. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of -15 dBm or less to the evaluation board but do NOT enable the RF signal. 3. Connect a spectrum analyzer to the RF signal output port. 4. Enable the power supply. 5. Enable the RF signal. 6. Take measurements. CAUTION: If any of the output signals exceed the rated maximum values, the SKY65028-70LF evaluation board can be permanently damaged. R3 R2 R1 C7 C1 C2 C3 C8 C9 C5 C6 C4 L2 L1 J1 (RF In) JP1 J2 (RF Out) Evaluation Board Assembly Layer 3: Ground Layer 4: Solid Ground Plane Layer 1: Top - Metal Layer 2: Ground Evaluation Board Layer Detail |
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