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SKY65230-11 Datasheet(PDF) 11 Page - Skyworks Solutions Inc. |
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SKY65230-11 Datasheet(HTML) 11 Page - Skyworks Solutions Inc. |
11 / 13 page DATA SHEET • SKY65230-11 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 200547 Rev. F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • May 7, 2007 11 Solder Mask Package Outline 0.20 X 45 Pin 48 Pin 1 48X 0.6 mm 10.44 mm L C 0.425 mm 14.44 mm 0.85 mm Typ. L C 48X 0.85 mm 2X 1.525 mm 2X 1.875 mm 2X 4.075 mm 6X 2.1 mm 6X 5 mm 2.2 mm Typ. 6X 0.725 mm 0.425 mm 8X 2.3 mm 2 mm Typ. Recommended Footprint Pin 47 Pin 1 10.34 mm 24X 0.5 mm 24X 0.75 mm 0.425 mm 0.85 mm Typ. 0.35 mm 14.34 mm 0.25 mm Typ. 0.175 mm Typ. CL 1.4 mm 1.4 mm 0.7 mm Thermal Via Array 0.3 mm on 0.7 mm Pitch Pad Will Improve Thermal Performance Additional Vias in Common Ground CL 0.7 mm 0.35mm Thermal vias should be tented and filled with solder mask 30–35 µm copper plating recommended. Stencil Pattern 10.34 mm 14.34 mm 48X 0.75 mm 48X 0.5 mm 0.425 mm 0.85 mm Typ. 0.20 X 45 mm 0.425 mm 6X 2.1 mm 6X 5 mm 8X 2.3 mm CL L C 2X 2.975 mm Package Outline Stencil Aperture Size of 80–100% of the Module/Pkg. Solder Mask Openings |
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