DATA SHEET • SKY65230-11

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

200547 Rev. F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • May 7, 2007

11

Solder Mask

Package Outline

0.20 X 45

Pin 48

Pin 1

48X 0.6 mm

10.44 mm

L

C

0.425 mm

14.44 mm

0.85 mm Typ.

L

C

48X 0.85 mm

2X 1.525 mm

2X 1.875 mm

2X 4.075 mm

6X 2.1 mm

6X 5 mm

2.2 mm Typ.

6X 0.725 mm

0.425 mm

8X 2.3 mm

2 mm Typ.

Recommended Footprint

Pin 47

Pin 1

10.34 mm

24X 0.5 mm

24X 0.75 mm

0.425 mm

0.85 mm Typ.

0.35 mm

14.34 mm

0.25 mm

Typ.

0.175 mm

Typ.

CL

1.4 mm

1.4 mm

0.7 mm

Thermal Via Array

0.3 mm on 0.7 mm Pitch

Pad Will Improve Thermal Performance

Additional Vias in Common Ground

CL

0.7 mm

0.35mm

Thermal vias should be tented and filled with solder mask 30–35 µm

copper plating recommended.

Stencil Pattern

10.34 mm

14.34 mm

48X 0.75 mm

48X 0.5 mm

0.425 mm

0.85 mm Typ.

0.20 X 45 mm

0.425 mm

6X 2.1 mm

6X 5 mm

8X 2.3 mm

CL

L

C

2X 2.975 mm

Package

Outline

Stencil Aperture

Size of 80–100%

of the Module/Pkg.

Solder Mask Openings