MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>

PS11037

FLAT-BASE TYPE

INSULATED TYPE

Jan. 2000

PRELIMINARY

Notice:

This

is not

a final

specification.

Some

parametric

limits

are subject

to change.

ton

tc(on)

toff

tc(off)

trr

Condition

Symbol

Item

Ratings

Unit

(Note 2)

—

(Fig. 3)

60 Hz sinusoidal AC applied between all terminals and

the base plate for 1 minute.

Mounting screw: M4

—

Junction temperature

Storage temperature

Module case operating temperature

Isolation voltage

Mounting torque

–20 ~ +125

–40 ~ +125

–20 ~ +100

2500

0.98 ~ 1.47

°C

°C

°C

Vrms

N·m

TOTAL SYSTEM

(Note 2) : The indicated values are specified considering the safe operation of all the parts within the ASIPM. The max. ratings for the ASIPM

power chips (IGBT & FWDi) is Tj < 150.

Condition

Symbol

Item

Ratings

Inverter IGBT (1/6)

Inverter FWDi (1/6)

Case to fin thermal, grease applied (1 Module)

Rth(cf)

Junction to case Thermal

Resistance

Contact Thermal Resistance

Min.

°C/W

°C/W

°C/W

THERMAL RESISTANCE

Typ.

Max.

—

—

—

—

—

—

1.75

2.4

0.031

Unit

Short circuit endurance

(Output, Arm, and Load, Short Circuit Modes)

Switching SOA

(Shunt voltage drop not included)

1/2 Bridge inductive, Input = 5V

↔ 0V

Note: ton, toff include delay time of the internal control

circuit.

Condition

Symbol

Item

Ratings

Min.

V

V

µs

µs

µs

µs

µs

Typ.

Max.

—

—

0.3

—

—

—

—

—

—

0.6

0.5

1.6

0.5

0.12

2.9

2.9

1.5

1.0

2.5

1.2

—

Unit

≤ 400V, Input = 5V → 0V (One-Shot)

–20°C

≤ 400V, Input = 5V ↔ 0V, Tj ≤ 125°C

• No destruction

• No destruction

• No protecting operation

Collector-emitter saturation

voltage

FWDi forward voltage

Switching times

FWDi reverse recovery time

CASE TEMPERATURE MEASUREMENT POINT

Tc

LABEL

(Fig. 3)