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SMP1322-099 Datasheet(PDF) 4 Page - Skyworks Solutions Inc. |
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SMP1322-099 Datasheet(HTML) 4 Page - Skyworks Solutions Inc. |
4 / 5 page Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com May 30, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200140 Rev. C DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME 4 Wafer On Film Grip Ring 0.003 (0.076 mm) Separation Between Die 3.940 (100 mm) Wafer Dia. 5.520 (140.2 mm) Inner Ring I.D. 5.981 (151.92 mm) Outer Ring O.D. 0.236 (5.99 mm) Ring Thickness 0.003 (0.076 mm) Nom. Separation Between Die Wafer Film Frame Description ● Wafer on nitto tape ● Color: light blue ● Thickness: 2.2–3 mils ● Tensile strength: 6.6 (lbs. in width) ● Ring material: plastic |
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