BULD25D, BULD25DR, BULD25SL

NPN SILICON TRANSISTOR WITH INTEGRATED DIODE

10

JULY 1994 - REVISED SEPTEMBER 1997

PRODUCT

INFORMATION

SL003

3-pin plastic single-in-line package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

MECHANICAL DATA

NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.

B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.

1,854 (0.073) MAX

0,711 (0.028)

0,559 (0.022)

3 Places

1

2

3

Pin Spacing

2,54 (0.100) T.P.

(see Note A)

2 Places

12,9 (0.492)

MAX

4,57 (0.180)

MAX

6,60 (0.260)

6,10 (0.240)

0,356 (0.014)

0,203 (0.008)

3 Places

SL003

10,2 (0.400) MAX

8,31 (0.327)

MAX

4,267 (0.168)

MIN

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

Index

Dot

MDXXAD