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KBU1001G Datasheet(PDF) 1 Page - Taiwan Semiconductor Company, Ltd

Part # KBU1001G
Description  Single Phase 10 AMPS. Glass Passivated Bridge Rectifiers
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Manufacturer  TSC [Taiwan Semiconductor Company, Ltd]
Direct Link  http://www.taiwansemi.com
Logo TSC - Taiwan Semiconductor Company, Ltd

KBU1001G Datasheet(HTML) 1 Page - Taiwan Semiconductor Company, Ltd

  KBU1001G Datasheet HTML 1Page - Taiwan Semiconductor Company, Ltd KBU1001G Datasheet HTML 2Page - Taiwan Semiconductor Company, Ltd  
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Dimensions in inches and (millimeters)
- 700 -
Version: A06
KBU1001G - KBU1007G
Single Phase 10 AMPS.
Glass Passivated Bridge Rectifiers
KBU
Features
UL Recognized File # E-96005
Glass passivated junction
Ideal for printed circuit board
Reliable low cost construction
Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
Surge overload rating to 200 amperes peak
High temperature soldering guaranteed:
260
oC / 10 seconds / .375”, (9.5mm) lead
lengths at 5 lbs., (2.3kg) tension
Weight: 0. 3 ounce, 8.0 grams
Mounting torque: 5 in. lb. Max.
Maximum Ratings and Electrical Characteristics
Rating at 25
oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol
KBU
1001G
KBU
1002G
KBU
1003G
KBU
1004G
KBU
1005G
KBU
1006G
KBU
1007G
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
@TA =45
oC
I(AV)
10.0
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
IFSM
200
A
Maximum Instantaneous Forward Voltage
@ 5.0A
@ 10.0A
VF
1.0
1.1
V
Maximum DC Reverse Current @ TA=25
oC
at Rated DC Blocking Voltage @ TA=125
oC
IR
5.0
500
uA
uA
Typical Thermal Resistance (Note)
RθJC
2.2
oC/W
Operating Temperature Range
TJ
-55 to +150
oC
Storage Temperature Range
TSTG
-55 to + 150
oC
Note: Thermal Resistance from Junction to Case with Device Mounted on 4” x 6” x 0.25” Heatsink.


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