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BH616UV1611DIP55 Datasheet(PDF) 1 Page - Brilliance Semiconductor |
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BH616UV1611DIP55 Datasheet(HTML) 1 Page - Brilliance Semiconductor |
1 / 12 page Ultra Low Power/High Speed CMOS SRAM 1M X 16 bit / 2M x 8-bit BH616UV1611 R0201-BH616UV1611 Revision 1.3 Otc. 2006 1 Pb-Free and Green package materials are compliant to RoHS n FEATURES Ÿ Wide V CC low operation voltage : 1.65V ~ 3.6V Ÿ Ultra low power consumption : VCC = 3.6V Operation current : 10mA (Max.) at 55ns 2mA (Max.) at 1MHz Standby current : 5.0uA (Typ.) at 3.0V/25 OC VCC = 1.2V Data retention current : 1.5uA(Typ.) at 25 OC Ÿ High speed access time : -55 55ns (Max.) at VCC=1.65~3.6V -70 70ns (Max.) at VCC=1.65~3.6V Ÿ Automatic power down when chip is deselected Ÿ Easy expansion with CE1, CE2 and OE options Ÿ I/O Configuration x8/x16 selectable by LB and UB pin. Ÿ Three state outputs and TTL compatible Ÿ Fully static operation, no clock, no refresh Ÿ Data retention supply voltage as low as 1.0V n DESCRIPTION The BH616UV1611 is a high performance, ultra low power CMOS Static Random Access Memory organized as 1,048,576 by 16 bits and operates in a wide range of 1.65V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.0V/25 OC and maximum access time of 55ns at 1.65V/85 OC. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2) and active LOW output enable (OE) and three-state output drivers. The BH616UV1611 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BH616UV1611 is available in DICE form, JEDEC standard 48-pin TSOP-I and 48-ball BGA package. n POWER CONSUMPTION POWER DISSIPATION STANDBY (ICCSB1, Max) Operating (ICC, Max) VCC=3.6V VCC=1.8V PRODUCT FAMILY OPERATING TEMPERATURE VCC=3.6V VCC=1.8V 1MHz 10MHz fMax. 1MHz 10MHz fMax. PKG TYPE BH616UV1611DI DICE BH616UV1611BI BGA-48-0810 BH616UV1611TI Industrial -40 OC to +85OC 30uA 25uA 2mA 6mA 10mA 1.5mA 5mA 8mA TSOP I-48 n PIN CONFIGURATIONS n BLOCK DIAGRAM Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice. Detailed product characteristic test report is available upon request and being accepted. Address Input Buffer Row Decoder Memory Array 1024 x 16384 Column I/O Write Driver Sense Amp Column Decoder Address Input Buffer A7 A4 A3 A2 Data Input Buffer Control DQ0 . . . . . . DQ15 A15 A14 A13 A12 A11 A10 A9 A8 A19 A18 16 16 16 16 10 1024 16384 1024 10 A16 Data Output Buffer A5 CE2, CE1 WE OE UB LB VCC VSS A1 . . . . . . A6 A17 A0 A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE2 NC UB LB A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BH616UV1611TI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE VSS DQ15/A20 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE VSS CE1 A0 G H F E D C B A 1 2 3 4 5 6 A9 A11 A10 NC A12 A14 A13 A15 WE DQ13 DQ5 DQ7 DQ6 A17 A16 A7 VSS VCC DQ12 DQ11 DQ4 DQ3 NC A5 OE A3 A0 A6 A4 A1 A2 CE2 UB DQ10 DQ1 CE1 DQ2 DQ0 48-ball BGA top view LB DQ8 DQ9 VSS VCC DQ14 DQ15 A18 A19 A8 |
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Similar Description - BH616UV1611DIP55 |
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