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BH616UV8010DIP55 Datasheet(PDF) 9 Page - Brilliance Semiconductor |
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BH616UV8010DIP55 Datasheet(HTML) 9 Page - Brilliance Semiconductor |
9 / 11 page BH616UV8010 R0201-BH616UV8010 Revision 1.2 May. 2006 9 n ORDERING INFORMATION Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. n PACKAGE DIMENSIONS PACKAGE D: DICE A: BGA-48-0608 T: TSOP I-48 BH616UV8010 X X Z Y Y GRADE I: -40 oC ~ +85oC SPEED 55: 55ns 70: 70ns PKG MATERIAL -: Normal G: Green, RoHS Compliant P: Pb free, RoHS Compliant 48 mini-BGA (6 x 8) D1 VIEW A 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. BALL PITCH e = 0.75 D 8.0 6.0 E N 48 3.75 E1 D1 5.25 NOTES: |
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