HMC582LP5 datasheet(4/8 Pages) HITTITE | MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 11.1

Part No.	HMC582LP5

Description	MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 11.1 - 12.4 GHz

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Manufacturer	HITTITE [Hittite Microwave Corporation]

Direct Link	http://www.hittite.com

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Absolute Maximum Ratings

Outline Drawing

Vcc(Dig), Vcc(Amp), Vcc(RF)

+5.5 Vdc

Vtune

0 to +15V

Junction Temperature

135 °C

Continuous Pdiss (T=85 °C)

(derate 43.5 mW/C above 85 °C

2.17 W

Thermal Resistance

(junction to ground paddle)

23 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1A

Typical Supply Current vs. Vcc

Note: VCO will operate over full voltage range shown above.

Vcc (V)

Icc (mA)

4.75

320

5.00

350

5.25

380

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC582LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H582

XXXX

HMC582LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H582

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

v00.0407

MMIC VCO w/ HALF FREQUENCY OUTPUT

& DIVIDE-BY-4, 11.1 - 12.4 GHz

HMC582LP5 / 582LP5E

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