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TLE2141ACP Datasheet(PDF) 3 Page - Texas Instruments |
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TLE2141ACP Datasheet(HTML) 3 Page - Texas Instruments |
3 / 29 page TLE2141, TLE2141A, TLE2141Y EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS SLOS062D – NOVEMBER 1990 – REVISED AUGUST 1994 5–3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 symbol + – OUT IN + IN – OFFSET N1 OFFSET N2 TLE2141Y chip information This chip, when properly assembled, displays characteristics similar to the TLE2141. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – OUT IN + IN – VCC+ (7) (3) (2) (6) (4) VCC – (1) (5) OFFSET N1 OFFSET N2 65 64 (7) (6) (5) (4) (3) (2) (1) |
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